A few months ago, at a time when, Qualcomm has not disclosed the full specifications of its upcoming Snapdragon 820, there were rumors that the chip suffers from overheating. Manufacturer immediately denied the report, claiming that the 820th working within the parameters. The new report of Asia again brings skepticism about the new chipset.
The report states that Samsung Galaxy S7 thinking about equipping a heat pipe.
Samsung is reportedly experimenting with heat pipes of different types and shapes to make a decision by year-end. S7 is not the first smartphone, which integrated heat pipes.
Xperia Z5 Prime, Xiaomi Mi Note Pro, and OnePlus 2 also received this decision in an effort to minimize problems with overheating Snapdragon 810.
According to unofficial information, Samsung Galaxy S7 will be released in two versions, one running on Exynos 8890 chipset, the second will be based on Qualcomm Snapdragon 820 processor.
Of course, it is too early to draw conclusions about the Snapdragon 820 as a more efficient heat removal system can improve the overall performance of any mobile processor. It remains to wait for the new of insider, who will provide more information.