A couple of weeks ago, we saw a tweet by Evan Blass, who provided the names of all the Galaxy S7 variations. Thus, it became known that Samsung will manufacture Samsung Galaxy S7, Samsung Galaxy S7 Edge, Samsung Galaxy S7 Edge Plus and Samsung Galaxy S7 Plus.
All of these devices should be made public on February 21 in the framework of Samsung Unpacked, which will be held the day before the opening of the exhibition MWC in Barcelona.
Today, some of the images Galaxy S7 devices and Galaxy S7 Plus leaked to the network.
The photos show a rectangular smartphone Home button. Also we can see that the volume buttons smartphones are on the left side, and the power button located on the right end of the device.
Looking at the larger Galaxy S7 Plus, you can expect, it can be equipped with a 6-inch screen.
It is known that “under the hood” Both flagships located chipset Exynos 8890. In China and the United States, Samsung will offer smartphones Snapdragon 820-based.
We only need to wait for receipt of new details to learn more about the upcoming flagship smartphones.