Earlier this year, we learned that the Samsung Galaxy S7, which will be sold in the US and China, will be equipped with Snapdragon 820. Later it became known that Samsung is thinking about how to put in a smartphone heatpipes. Now the network has information that tells about the reason for such a decision.
One Weibo liksterov noted that the version of the Snapdragon 820 chip in the Galaxy S7 will be optimized for improved thermal management and low power consumption.
Since this enhanced version of the Snapdragon 820 will operate at a higher frequency than the regular version, the heat pipe will be added to help with the thermal control.
The report also said that an enhanced version of Snapdragon 820 scored an impressive 2456 points in single-core GeekBench test. Multicore test also showed good results in 5423 points.
If this test is true, the US and Chinese buyers do not have any performance problems.
It is expected that the upcoming flagship will be presented Feb. 21, the day before the opening of the MWC in Barcelona.