Specifications Helio X30, more powerful than the Snapdragon 820?

Specifications Helio X30, more powerful than the Snapdragon 820?

Helio X30, will be manufactured by TSMC, using 10-nanometer FinFET process, making it twice as effective Helio X20. The new SoC will use the new ARM Artemis kernel with less powerful cores Cortex, and will continue to have trёhklasternoy architecture.

At the end of last month, we told you that the company MediaTek reportedly working-touch Helio X30 chipset. Today, an analyst at Pan Dzhiyutang confirmed the presence of the chip. Moreover, thanks to the Chinese insider, we know not only the chipset’s characteristics, but also get an idea of ​​its performance.

Specifications Helio X30, more powerful than the Snapdragon 820?

Helio X30, will be manufactured by TSMC, using 10-nanometer FinFET process, making it twice as effective Helio X20. The new SoC will use the new ARM Artemis kernel with less powerful cores Cortex, and will continue to have trёhklasternoy architecture.

Thus, a processor will receive two Artemis core 2.8GHz, quad-core Cortex-A53 with a frequency of 2.2 GHz and four Cortex-A35 core 2 GHz. For graphics component will be responsible processor PowerVR 7XT. Helio X30 will support dual camera module, the camera with a resolution of 26 megapixels, VR, LTE cat.13 and 8 GB of RAM.

At its Weibo page Dzhiyutang Hello posted AnTuTu benchmark comparison table dozens of different chipsets. Helio X30 scored 160,000 points, taking first place in the list and surpassing the Snapdragon 820, which is now the best chip and installed in such leaders as the Galaxy S7, LG G5 and HTC 10.

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